Printed Wiring Board Materials Business Sector 2 IEEE2011 Roadmap of Infrastructure-Communication Network Servers Transmission Rate: 1.5 Gbps⇒⇒⇒⇒3 Gbps Dk:4.0, Df:<0.010 Level Routers 30Layers ⇒⇒⇒⇒ 40 Layers Lead-Free applicable Narrow Pitch, Symmetrical Packaging Reflow Temp: 260 oC Super Computers Transmission Rate: 5 Gbps⇒⇒⇒⇒10 Gbps Dk:3.5, Df:<0.005 Level High-End Giga bit Router 30Layers ⇒⇒⇒⇒ 50 Layers Heat Resistance for Lead Free Base Station:Back panel Reflow Temp: 260 oC RF modules for Halogen Free Materials applied Dk:<3.7, Df:<0.007 Level Mobile Handset Devices Frequency: 1.5 GHz ⇒⇒⇒⇒ 3 GHz High Thickness Accuracy (PA, Filter ,etc) 4Layers ⇒⇒⇒⇒ 6Layers, Higher Density Laser drill process ability Reflow Temp: 260 oC Heat Resistance(Lead Free) Halogen Free requirement Halogen free material Antenna of Base Station Frequency: 1.5 GHz ⇒⇒⇒⇒ 3 GHz Dk:<3.5, Df:<0.003 Level Phase Shifters, From Teflon & PPE boards Lower Process Cost Anti crash rader on to Lower Cost Materials Drift of electric property on automotive and etc Frequency: 24 GHz ⇒⇒⇒⇒ 76 GHz water absorption Application Required Properties of Base Materials General High- Frequency Properties (Functions)Field 3 IEEE2011 Teflon Grade D f( 1 G H z ) Dk(1 GHz) 0.0020 0.0040 0.0060 0.0080 0.0100 0.0120 0.0140 0.0160 0.0180 0.0200 0.0220 0.0240 0 4.4 4.3 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.8 Standard FR4 High Tg FR-4 Filled High Tg ※※※※ JPCA TM001/IPC TM650 2.5.5.5.1JPCA TM001/IPC TM650 2.5.5.5.1JPCA TM001/IPC TM650 2.5.5.5.1JPCA TM001/IPC TM650 2.5.5.5.1 Property map of high frequency materials FX-3 HighHigh--End GradeEnd Grade DkDk 3.7 / 3.7 / DfDf 0.0070.007 JPCAJPCA--HCL01/21HCL01/21 IEC 61249IEC 61249--22--32/3432/34 MiddleMiddle--Range GradeRange Grade DkDk 4.1 / 4.1 / DfDf 0.0170.017 JPCAJPCA--HCL02/22HCL02/22 IEC 61249IEC 61249--22--31/3331/33 Fx-2 4 IEEE2011 Requirement of Material for High-Frequency PWBs Stripline Propagation delay time Td = Dk c Characteristic impedance Zo = w tb 60 Dk 4b 0.67p(0.8w + t) In Transmission loss( a ) = Conductor loss( ac ) + Dielectric loss( ad ) ad = 27.3 Dk Df f c Dk : dielectric constant, Df : Dissipation factor, f : Frequency, c : Light velocity b : Dielectric layer thickness w : Conductor width t : Conductor thickness Important issue in high-frequency circuits Reducing transmission loss / Reduction of ad Low Dk & Df Resin Technology (Excellent dielectric properties & Stable Dk &Df for the wide range of frequency, temperature, humidity, …..) / Reduction of ac Original Profile-Free Conductor (High adhesion technology for very low surface roughness foil) < Solution for Requirement > 5 IEEE2011 Low Dk & Low Df Thermosetting resin system (Low-polar cross-linking design) Non-polar & Rigid Liner polymer Semi-IPN structure resin by Original polymer alloy technologyStable Dk & Df vs.