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https://grouper.ieee.org/groups/802/3/10G_study/email/msg00320.html
This "bridge" could then be sucked into the chip > holding the MAC as 1GHz+ I/O busses become available.
https://grouper.ieee.org/groups/802/3/1TPCESG/public/20140528_CSD_IEEE802_3bw.pdf
.)  Consolidation of legacy in-car networks into the new homogenous Electronic Architecture  Other applications include  Transportation (e.g. trains, busses, airplane cabins, traffic control systems, etc.) and similar applications  Industrial automation solutions using Ethernet for factory and process automation including instrumentation control and measurements.  The 1 Twisted Pair 100 Mbit/s interface will improve the favorable cost balance for in- vehicle applications operating over single twisted pair balanced cabling.
https://grouper.ieee.org/groups/802/3/ba/public/may08/giannakopoulos_01_0508.pdf
This is assuming all 10 (100 GE) or 4 (40 GE) SerDes in same chip – This should potentially introduce only a small amount of skew quantified by the uncertainty on the FIFO reset mechanism and de/serializer-related skew – There should be no skew in the stages feeding the Tx FIFOs – Total amount of TX skew should be in the order of 1.8 ns for reset/serializer uncertainty and another 0.2 ns for skew induced from driver/package, total of upto 2 ns – Numbers for RX side are also in the order of upto 2 ns 8 PCS/MLD skew – FPGA case MLD i/f TX PCS/MLD FPGA 10 or 4 lanes @10G PMA/PMD 10G SerDes Core logic 10G SerDes 10 or 4 10G SerDes 10G SerDes 10 or 4 RX 10 or 4 lanes @10G 16b @644M 644M SerDes (x16) 644M SerDes (x16) 644M SerDes (x16) 644M SerDes (x16) 64b @160M 64b @160M 64b @160M 64b @160M 16b @644M 16b @644M 16b @644M MLD i/f: 10 lanes for 100 GE or 4 lanes for 40GE @10G 9 PCS/MLD skew – FPGA case FPGA solution with external 10G SerDes devices – Since current FPGA technology does not support 10G links (SerDes), board level solutions need to connect a MAC/PCS FPGA to 10 (100 GE) or 4 (40 GE) 10G SerDes devices – Assuming a 16-bit i/f between FPGA and external 10G SerDes: still need internal FPGA SerDes to convert from a wide databus to serial 644 Mb/s (16 of them per 10G) – a 4-bit or 2-bit i/f are alternative options – Stages feeding the internal SerDes can introduce upto 12.8 ns (2x64 bits) of skew – Number of pins and internal FPGA SerDes required might prohibit single-FPGA device implementation for 100GE, unless narrower external busses are used (RXAUI for example) 10 PCS/MLD skew (TX and RX), cont. - FPGA FPGA solution with external 10G SerDes devices (cont.) – External SerDes devices are difficult to synchronize, so skew can be introduced by different fill levels in their FIFOs – with a FIFO size of 8 by 16 bits, could have a skew of 7*1.6 ns = 11.2 ns (applies to Tx, no FIFO in Rx) – Add in upto 1.5 ns max for serializer skew – In Rx, no FIFO is needed, deserializer skew can be upto 1.5 ns – Do not expect electrical skew in a 16-bit clocked i/f @644M between FPGA and external SerDes 11 MLD interface Electrical skew (TX and RX) – Calculation of skew requires modeling using controlled impedance traces on standard FR4 low-cost PCBs – A good starting point would be the XFI interface for a chip to chip interconnect • current XFI i/f allows for 9.6dB of loss @5.5GHz • allows for a range from 1” to 8-10” typically 12 MLD i/f Electrical skew (TX and RX) (cont.) – If we assume a 10” range then the upper bound of skew is 10’’, which translates into 10*220ps/in = 2.2ns, so 4.4 ns for TX and RX – Could never happen ☺☺☺☺ – A more realistic scenario would be 1-2” of board skew, 2” translates to 0.88 ns – PCB designers could give more accurate skew data, depends on board size, number of layers etc – Propose a generous 4” of trace length difference allowance, equates to 1.76 ns for both RX and TX 13 PMD/PMA skew (TX and RX), 4x25G MLD protocol supports bit muxing at the MLD i/f as well as at the line side PMA is a simple bit MUX/DeMUX – internal skew should be less than 0.4 ns (per chip, per direction), including analog and digital skew PMA to PMD connection – Traces should in any case be carefully laid out – Should be less than 1” (per direction), which is 0.45 ns (RX and TX) 14 Transmission skew Dependent on PMD type For an SMF optical solution, a 10Km range has a max skew @1300 nm of 1.7ns for transmission skew (4x25G or 4x10G case) For a parallel fiber MMF case @850nm, assuming 44.3ps/m skew accumulation, a 100m range results in 4.43 ns of skew Objective for copper is 10m, therefore the skew contribution should be smaller than the optical cases Not a current objective, but if in the future a 80 km solution is used, then 80 km @ 1550 nm (800 GHz spacing in C band, 4x25G) would result in a 33.2 ns skew 15 Max skew budget – 40GE In all modes: – TX electrical (FPGA): 25.5+0.88+0.62 = 27 ns – RX electrical (FPGA): 14.3+0.88+0.62 = 15.8 ns – TX+RX electrical (FPGA) = 42.8 ns 10Km SMF, CWDM mode – Optical interface (1300 nm, 4x10G): 1.7ns – TOTAL: 42.8 + 1.7 = 44.5 ns 100m MMF, parallel fibers – Optical interface (850 nm): 4.43ns – TOTAL: 42.8 + 4.43 = 47.23 ns 300m MMF, parallel fibers (not an objective) – Optical interface (850 nm): 13.29ns – TOTAL: 42.8 + 13.29 = 56.09 ns 16 Max skew budget – 100GE In all modes: – TX+RX electrical (FPGA) = 42.8 ns (same as in 40GE) 10Km SMF, CWDM – Optical interface (1300 nm, 4x25G): 1.7ns – TOTAL: 42.8 + 1.7 = 44.5 ns 40Km SMF, DWDM – Optical interface (800 GHz spacing): 0.72ns – TOTAL: 42.8 + 0.72 = 43.52 ns 80Km SMF, DWDM (not an objective) – Optical interface (1550 nm, 800 GHz spacing): 33.14ns – TOTAL: 42.8 + 33.14 = 75.94 ns 100m MMF, parallel fibers – Optical interface (850 nm): 4.5ns – TOTAL: 42.8 + 4.43 = 47.23 ns 300m MMF, parallel fibers (not an objective) – Optical interface (850 nm): 13.29ns – TOTAL: 42.8 + 13.29 = 56.09 ns 17 Summary Table for max skew 2 (ASIC) 12.8+1.5 = 14.3 (FPGA solution) PCS/MLD RX 0.62PMA/PMD TX 1.7 Optical SMF (4x10 or 4x25G @1300nm) 4.43 Parallel Fiber MMF (4x or 10x10G @850nm) Transmission 0.62PMA/PMD RX 0.88Electrical MLD i/f RX 11.43 (ASIC) 47.23 (FPGA solution) TOTAL 0.88Electrical MLD i/f TX 2 (ASIC) 12.8+11.2+1.5 = 25.5 (FPGA solution) Max Skew (ns) for objectives PCS/MLD TX Contributor 18 Proposals for skew contributors Propose a 4” MLD interface board trace skew which results in 1.76 ns skew (total RX+TX) Propose a 1” board trace skew for PMA to PMD electrical skew (0.44 ns total RX+TX) 19 Max Skew budget proposal From summary Table: max_estimated_skew = 47.23 ns (for objectives) Propose allowing for a wide margin – for future technology (80 Km reach e.g. ?)
https://grouper.ieee.org/groups/802/3/ct/email/msg01029.html
. * Public Transit Busses, Regional Train Service, S-Bahn Commuter Train* , Rental Car, Ride Share *The stop closest to Estrel Berlin is called Sonnenallee.
https://grouper.ieee.org/groups/1149/4/kenpfax.html
If you look at the MEI drawings (MEI document from ITC) in Figures 5, 6 and 8 you will notice that none of these are qualified by the current effective instruction, meaning that even during BYPASS, switches can be closed and affect pins and busses.
https://grouper.ieee.org/groups/802/3/minutes/nov98/A4_1198.pdf
P P 2 Brewer, Steve 3Com Corporation P P P P 4 Bridgers, Vince Level One Communications P P P 3 Brown, Benjamin Nortel Networks P P P P 4 Bunch, Bill Epigram P 1 Busse, Robert Transition Networks P P P P 4 Butler, Kent Racore Technology Corp.
https://grouper.ieee.org/groups/802/3/SPMD/email/msg00459.html
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https://grouper.ieee.org/groups/802/3/minutes/mar04/0304_Open_report.pdf
Bemmel, Vincent Bennett, Mike Bhatt, Vipul Bohbot, Michel Booth, Brad Bradshaw, Peter Braga, Al Brand, Richard Brown, Benjamin Brown, Kevin Busse, Robert Cain, Jeff Carlo, James T.
https://grouper.ieee.org/groups/802/3/minutes/jul03/0703_Open_report.pdf
Bhatt, Vipul Booth, Brad Bottorff, Paul Braga, Al Brand, Richard Brown, Benjamin Brown, Kevin Burton, Scott Busse, Robert Bynum, Roy Cain, Jeff Cam, Richard Carlson, Steve Carnine, Dan Chang, Justin Chen, Xiaopeng Chow, Jacky Claseman, George Cobb, Terry Cook, Charles I Cravens, George Cross, Richard Cullin, Chris Daines, Kevin Dallesasse, John Darshan, Yair Dawe, Piers Di Minico, Chris 21 July 2003 IEEE 802.3 Opening Plenary 8 802.3 Members (voters) p.2 Diab, Wael Dineen, Thomas Dove, Dan Dwelley, David Easley, J.
https://grouper.ieee.org/groups/802/3/minutes/jul04/0704_open_report.pdf
Bemmel, Vincent Bennett, Mike Bhatt, Vipul Bohbot, Michel Booth, Brad Bradshaw, Peter Braga, Al Brand, Richard Brown, Benjamin Brown, Kevin Busse, Robert Cain, Jeff Carlo, James T.
https://grouper.ieee.org/groups/802/3/minutes/jul06/0706_attendance.pdf
P P P Brownlee, Phillip Coilcraft P P Brunner, Robert Ericsson Research P P P Buckmeier, Brian Bel Fuse P Busse, Robert Transition Networks P P P P Cain, Jeff Cisco Systems, Inc.
https://grouper.ieee.org/groups/802/3/minutes/jul08/0708_close_report.pdf
Bennett, Mike Booth, Brad Braun, Ralf-Peter Busse, Robert * Cain, Jeff Carlson, Steve Carroll, J.
https://grouper.ieee.org/groups/802/3/minutes/jul14/0714_1tpce_close_report.pdf
.)  Consolidation of legacy in-car networks into the new homogenous Electronic Architecture  Other applications include  Transportation (e.g. trains, busses, airplane cabins, traffic control systems, etc.) and similar applications  Industrial automation solutions using Ethernet for factory and process automation including instrumentation control and measurements.  The 1 Twisted Pair 100 Mbit/s interface will improve the favorable cost balance for in- vehicle applications operating over single twisted pair balanced cabling.
https://grouper.ieee.org/groups/802/3/minutes/jul14/0714_1tpce_open_report.pdf
.)  Consolidation of legacy in-car networks into the new homogenous Electronic Architecture  Other applications include  Transportation (e.g. trains, busses, airplane cabins, traffic control systems, etc.) and similar applications  Industrial automation solutions using Ethernet for factory and process automation including instrumentation control and measurements.  The 1 Twisted Pair 100 Mbit/s interface will improve the favorable cost balance for in- vehicle applications operating over single twisted pair balanced cabling.
https://grouper.ieee.org/groups/802/3/minutes/nov08/1108_close_report.pdf
. --------------------------------------------------------------- See IEEE-SA Standards Board Operations Manual, clause 5.3.10 and “Promoting Competition and Innovation: What You Need to Know about the IEEE Standards Association's Antitrust and Competition Policy” for more details. 25 March 2008Slide #4 Page 9Version 1.0 IEEE 802.3 Working Group Closing Plenary - November 2008 Agenda • Approve agenda Page 10Version 1.0 IEEE 802.3 Working Group Closing Plenary - November 2008 802.3 Members (voters) p.1 Abbas, Ghani Abbott, John Abbott, Justin Akasaka, Youichi Alping, Arne Anslow, Peter Baldwin, Thananya Bandyopadhyay, Jaya Barkan, Ozdal Barnette, Jim Barrass, Hugh Baumer, Howard Beaudoin, Denis Beia, Christian Bello, Eran Bennett, Michael Booth, Brad Braun, Ralf-Peter Breuer, Dirk Brown, Alan Busse, Robert Carlson, Steve Carroll, J.
https://grouper.ieee.org/groups/802/3/minutes/nov09/1109_attendance.pdf
Cisco Systems, Inc. 1 1 1 0 3 Beaudoin, Denis Texas Instruments Incorporated Texas Instruments Incorporated 1 1 1 1 4 Beckwith, Jonathan University of New Hampshire University of New Hampshire 1 1 1 1 4 Bennett, Michael Lawrence Berkeley National Lab Lawrence Berkeley National Lab 1 0 1 1 3 Booth, Brad AMCC AppliedMicro 1 0 0 0 1 Braun, Ralf-Peter Deutsche Telekom AG Deutsche Telekom AG 1 1 1 0 3 Brown, Matthew Applied Micro (AMCC) AMCC 1 1 1 1 4 Busse, Robert Transition Networks, Inc.
https://grouper.ieee.org/groups/802/3/minutes/nov04/1104_open_report.pdf
Bradshaw, Peter Braga, Al Brand, Richard Brown, Benjamin Brown, Kevin Busse, Robert Cain, Jeff Carlson, Steve Cates, Ron Chen, Xiaopeng Cheong, Kok-Wui Chopra, Rahul Chou, Joseph Chow, Jacky Claseman, George Cobb, Terry Cohen, Larry Cornejo, Edward Cravens, George Cunningham, David D'Ambrosia, John Dabiri, Dariush Daines, Kevin Dallesasse, John Dawe, Piers 15 November 2004 IEEE 802.3 Opening Plenary 7 802.3 Members (voters) p.2 De Andrea, John Di Minico, Chris Diab, Wael Dineen, Thomas Dove, Dan Dupuis, Joseph E.
https://grouper.ieee.org/groups/802/3/minutes/nov06/1106_attendance.pdf
P P Brunner, Robert Ericsson Research P P Buckmeier, Brian Bel Fuse P P Busse, Robert Transition Networks P P P P Cain, Jeff Cisco Systems, Inc.
https://grouper.ieee.org/groups/802/3/10G_study/email/msg01308.html
We are certainly not able to use any "buss" or "star" connections.
https://grouper.ieee.org/groups/802/3/10G_study/email/msg03397.html
Re: Proposal: XGMII = XBI+ Thread Links Date Links Thread Prev Thread Next Thread Index Date Prev Date Next Date Index Re: Proposal: XGMII = XBI+ To : "'802.3ae'" < stds-802-3-hssg@xxxxxxxx > Subject : Re: Proposal: XGMII = XBI+ From : "Roger Ronald" < rronald@xxxxxxx > Date : Thu, 21 Sep 2000 13:38:23 -0500 References : < 5921D0EE2081D2118D0D0000F8CD148C0B944382@xxxxxxxxxxxxxxxxx > Sender : owner-stds-802-3-hssg@xxxxxxxx Title: Re: Proposal: XGMII = XBI+ Since you issued a call for "roger", I'll jump in with a comment.  
https://grouper.ieee.org/groups/802/3/power_study/email/msg00698.html
Soon we will see cheap 802.af solutions and this means: 802.af makes it possible to replace industrial busses (profibus/interbus etc.) by powering sensors/actors, ISDN (by powering phones/gateways) and propriatary communication/control interfaces.
https://grouper.ieee.org/groups/802/3/10G_study/email/msg01918.html
One or more 10 Gbps and higher connections will be directly attached to these servers in the near future, requiring internal 10 Gbps and higher internal I/O busses.
https://grouper.ieee.org/groups/802/3/10G_study/email/msg01934.html
One or > more 10 Gbps and higher connections will be directly attached to these servers > in the near future, requiring internal 10 Gbps and higher internal I/O busses. > This is where interfaces like InfiniBand(TM) and PCI-XXX enter the picture (yeah > I made PCI-XXX up :-).
https://grouper.ieee.org/groups/802/3/minutes/mar10/0310_attendance.pdf
Cisco Systems, Inc. 1 1 1 30 Beaudoin, Denis Texas Instruments Incorporated Texas Instruments Incorporated 1 1 1 41 Belopolsky, Yakov Self Employed Bel Fuse 1 1 1 30 Bennett, Michael Lawrence Berkeley National Lab Lawrence Berkeley National Lab 1 1 1 30 Booth, Brad AMCC Applied Micro (AMCC) 1 1 0 31 Breuer, Dirk Deutsche Telekom AG Deutsche Telekom AG 1 1 1 41 Brown, Matthew Applied Micro (AMCC) AMCC 1 1 1 41 Busse, Robert Transition Networks, Inc.
https://grouper.ieee.org/groups/1788/email/msg01838.html
Re: Constructors & decorations Thread Links Date Links Thread Prev Thread Next Thread Index Date Prev Date Next Date Index Re: Constructors & decorations To : John Pryce < j.d.pryce@xxxxxxxxxxxx > Subject : Re: Constructors & decorations From : Dan Zuras Intervals < intervals08@xxxxxxxxxxxxxx > Date : Tue, 23 Feb 2010 04:17:50 -0800 Cc : stds-1788@xxxxxxxxxxxxxxxxx , Dan Zuras Intervals < intervals08@xxxxxxxxxxxxxx > Comments : In-reply-to John Pryce < j.d.pryce@xxxxxxxxxxxx > message dated "Tue, 23 Feb 2010 08:58:05 +0000."